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UID:intercon-peru-2026@exhibitionsvoice.com
DTSTAMP:20260802T011045Z
DTSTART:20261210T000000Z
DTEND:20261212T000000Z
SUMMARY:INTERCON 2026 – IEEE International Conference on Electronics\, Electrical Engineering and Computing
DESCRIPTION:INTERCON Peru (IEEE International Conference on Electronics\, Electrical Engineering and Computing – INTERCON 2026) is an academic and professional conference focused on electronics\, electrical engineering\, computing and related emerging technologies\, organized under the IEEE Peru Section and hosted by Universidad Privada Antenor Orrego (UPAO) in Trujillo\, Peru. For 2026\, official information indicates the event will run as a hybrid (in‑person and virtual) conference from December 10–12\, 2026\, rather than the previously communicated August 12 date. It brings together researchers\, educators\, industry professionals\, entrepreneurs\, and students for peer‑reviewed paper presentations\, keynotes\, technical sessions\, competitions\, and networking designed to foster collaboration and advance technologies that benefit society. INTERCON’s technical program typically includes tracks and sessions spanning electronics\, power and energy systems\, control and automation\, communications\, signal processing\, computer engineering\, software\, and interdisciplinary applications. Accepted papers are presented in oral or poster formats\, and the conference follows IEEE standards for submissions and proceedings\, making it an attractive venue for authors seeking international visibility and indexing. The 2026 edition continues this tradition\, emphasizing emerging and transformative technologies (aligned with IEEE Future Directions) and creating dialogue between academia and industry through invited talks and panels. Attendees can expect a structured three‑day agenda that blends technical depth with community building. The conference program page describes INTERCON 2026 as a hybrid event aimed at researchers and educators\, which implies simultaneous onsite sessions at UPAO in Trujillo and online access for remote participants. This format broadens participation across Peru and the wider Latin American region\, enabling students and professionals who cannot travel to still engage with the content. In parallel\, IEEE‑related competitions and activities such as RNR 2026 (regional student branch meeting at UPAO on August 10–11) provide complementary opportunities for student leadership development and networking around the same host institution. INTERCON matters for the Andean and Latin American engineering and computing communities because it offers a stable\, IEEE‑backed platform for disseminating research results\, building collaborations\, and aligning local innovation with global technological trends. By convening universities\, research centers\, and companies at UPAO\, the 2026 edition supports regional capacity building in key areas such as power systems\, smart grids\, embedded systems\, artificial intelligence\, and digital transformation. For young researchers and students\, presenting at INTERCON can be a significant step in their academic careers\, while for industry participants\, it is a chance to scout new talent and research partnerships. The hybrid 2026 format further increases impact by lowering geographic barriers and encouraging cross‑border participation.
LOCATION:Universidad Privada Antenor Orrego (UPAO)\, Campus UPAO\, Trujillo\, La Libertad\, Peru\, Trujillo\, Peru
URL:https://exhibitionsvoice.com/event/intercon-peru-2026
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