Trade Show
ELEXCON (Shenzhen International Electronics & Embedded Expo) 2026
ELEXCON (Shenzhen International Electronics & Embedded Expo) is a leading South China trade show dedicated to electronic components, embedded systems, and edge AI applications, held at Shenzhen World Exhibition & Convention Center (Bao’an) and co-located with CIOE and IICIE…
Directory listing reviewed June 2026
About ELEXCON (Shenzhen International Electronics & Embedded Expo) 2026
Overview
ELEXCON (Shenzhen International Electronics & Embedded Expo) is a leading South China trade show dedicated to electronic components, embedded systems, and edge AI applications, held at Shenzhen World Exhibition & Convention Center (Bao’an) and co-located with CIOE and IICIE. It serves as a comprehensive sourcing, technology, and innovation platform for engineers, R&D teams, procurement managers, and decision-makers across consumer electronics, automotive, communications, data centers, industrial control, medical and IoT sectors.
What to Expect
Visitors to ELEXCON 2026 can expect a concentrated showcase of next-generation electronics components, embedded systems and AI-enabled solutions tailored to the needs of design, engineering and procurement teams in South China and beyond. As a professional B2B exhibition, the show floor brings together suppliers of chips, memory, SoC/MCU/MPU devices, wireless modules, MEMS sensors, power management ICs, discrete power devices, industrial power supplies, passive components and advanced packaging solutions such as SiP and chiplet-based architectures. These exhibits are complemented by system-level solutions and reference designs for consumer electronics, automotive electronics, communications equipment, data centers, industrial control, medical electronics and IoT applications. The 2026 edition carries the theme “All for AI, All for Green”, signaling a strong focus on embedded AI and edge AI, intelligent terminals and energy-efficient design. Attendees will find AI terminal innovation technologies and new products that address real-world deployment of edge computing, sensor fusion, and AI acceleration across sectors. At the same time, power electronics, power semiconductors and green energy solutions emphasize lower losses, high-efficiency power conversion and sustainable system design. On-site forums and technical conferences—such as energy electronics and thermal management sessions—provide structured learning opportunities, where experts share application cases, design methodologies and future trends. The co-location with CIOE and IICIE significantly broadens the ecosystem. With optoelectronic technologies and integrated circuit innovation presented in neighboring halls, visitors can easily cross from device and component sourcing to advanced photonics and IC design content in a single visit. This joint platform, spanning hundreds of thousands of square meters according to Chinese-language materials, enables both wide-ranging market research and highly targeted supplier discovery in one trip. Exhibitors benefit from the combined visitor flow and from exposure to overlapping audience segments in optical communications, semiconductor manufacturing and intelligent hardware. Beyond the exhibits, attendees can expect matchmaking activities, technical presentations and themed zones that help them navigate critical topics such as automotive electronics, industrial IoT, data center infrastructure and AI edge computing. For engineers and technical buyers, this translates into hands-on evaluation of components and subsystems, direct dialogue with product managers and FAEs, and the ability to compare offerings across multiple brands under one roof. For managers and decision-makers, ELEXCON serves as a strategic vantage point to gauge innovation directions, supplier roadmaps and ecosystem partnerships in China’s fast-moving electronics industry.
Who Should Attend
ELEXCON 2026 is intended for professional stakeholders across the electronics and embedded systems value chain, rather than for general consumers. Core attendees include hardware and embedded engineers, firmware and software developers working on intelligent devices, system architects and integration specialists who must combine components into robust platforms. It is highly relevant for R&D managers, product managers and technical directors at OEMs, ODMs, EMS providers and solution integrators in sectors such as consumer electronics, automotive, telecommunications, data centers, industrial automation, medical devices and IoT. These roles benefit from direct exposure to the latest components, reference designs and design support resources offered by exhibitors. Procurement and sourcing professionals, supply chain managers and category buyers focused on semiconductors, power electronics, embedded modules, sensors and passive components will find ELEXCON an efficient sourcing hub. The breadth of suppliers and the co-location with CIOE and IICIE allow them to benchmark technology, pricing and delivery capabilities across domestic and international brands. The event also caters to technical decision-makers and strategists seeking insight into trends such as embedded AI, edge computing, green and energy-efficient electronics, and advanced packaging. Conference sessions and forums describe future roadmaps and application scenarios, making the show a useful reference point for medium- to long-term product and investment planning. Finally, start-ups, innovators and academic or research professionals exploring AI terminals, new materials, power devices or chiplet-based architectures can leverage the expo to connect with industry partners and understand commercialization pathways in China’s electronics market.
Why It Matters
ELEXCON 2026 matters because it functions as a central technology and sourcing hub for the electronics and embedded systems industry in South China, one of the world’s most dynamic hardware ecosystems. By concentrating component vendors, module providers, system solution houses and design service firms under a single roof, the expo shortens the distance between innovation ideas and deployable products. The 2026 theme “All for AI, All for Green” underscores two structural trends reshaping electronics: pervasive embedded AI/edge AI and the drive toward energy efficiency and sustainability. For engineering teams, this means access to silicon and subsystems that can add intelligence—through local inference, sensor analytics or real-time decision-making—directly into devices ranging from consumer gadgets to vehicles and industrial equipment. The presence of power semiconductors, power supplies and related solutions enables designers to simultaneously address efficiency, thermal constraints and regulatory requirements for greener systems. Co-location with CIOE and IICIE is strategically important. CIOE brings optoelectronic and photonic technologies, while IICIE focuses on integrated circuit innovation. Together with ELEXCON’s component and embedded focus, these events create a comprehensive ecosystem platform spanning chips, packaging, optics, modules and final system solutions. For companies navigating supply chain diversification, technology localization or collaboration with Chinese partners, the combined events offer high-density intelligence on domestic capabilities and global players. From a market perspective, the expo helps align suppliers and buyers on evolving requirements in sectors like automotive electronics, data centers, industrial control, medical electronics and IoT. Exhibitor roadmaps and live demonstrations reveal where investment is flowing—whether toward AI accelerators at the edge, chiplet-based architectures in packaging, or new materials and thermal management approaches in power electronics. Attending the show allows businesses to calibrate their own strategies against this backdrop. Finally, ELEXCON plays a role in knowledge transfer and community building. Conferences and forums provide platforms for experts to share guidance and case studies on complex topics such as AI terminal design, thermal management, high-reliability power systems and integration of optoelectronic components. This supports skill development in the engineering community and encourages collaboration across companies and disciplines. For stakeholders involved in product development, procurement, or technology planning in China’s electronics sector, ELEXCON 2026 is therefore both a practical sourcing venue and an important barometer of where the industry is heading.
Venue & directions
Shenzhen World Exhibition & Convention Center (Bao'an)
Bao’an District, Shenzhen, Guangdong Province, China
Shenzhen, China
Frequently Asked Questions
ELEXCON 2026 (Shenzhen International Electronics & Embedded Expo) is scheduled to take place from 9–11 September 2026. The show runs for three days, co-located with CIOE (China International Optoelectronic Exposition) and IICIE (International Integrated Circuit Innovation Exposition).
ELEXCON 2026 will be held at Shenzhen World Exhibition & Convention Center (Bao’an), Shenzhen, China. This modern venue in the Bao’an district offers large exhibition halls and conference facilities and hosts ELEXCON alongside CIOE and IICIE in the same complex.
Visitor pre-registration for ELEXCON 2026 is indicated as not yet open on the official site. Prospective attendees should monitor the official ELEXCON website’s audience or visitor registration section and complete online pre-registration once available, then bring the confirmation and ID to the venue for badge collection. Exhibitors and sponsors are advised to contact the organizer via the official contact channels listed on the site.
ELEXCON is organized by a professional exhibition company based in Shenzhen; the official English materials list contact numbers and the expo website as the primary organizer touchpoints. The main English site for the show is elexcon.com with an additional official expo site e.elexcon.com referenced in the 2026 brochure. These sites provide organizer contacts, exhibitor manuals and sponsorship information.
ELEXCON 2026 is co-located with CIOE (China International Optoelectronic Exposition) and IICIE (International Integrated Circuit Innovation Exposition) at the same venue and dates. The three events jointly offer extensive coverage from chips and electronics components to optoelectronic technologies and integrated circuit innovation, creating a large-scale, cross-domain technology platform.
According to official materials, ELEXCON 2026 focuses on themes such as “All for AI, All for Green” and highlights embedded AI and edge AI, memory, SoC/MCU/MPU, wireless technologies, MEMS sensors, power management ICs, power devices, industrial power supplies, passive components, and advanced packaging solutions including SiP and chiplet technologies. Visitors can expect exhibits and forums around AI terminals, power electronics, automotive electronics, and sustainable, energy-efficient solutions.
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