INTERCON 2026 – IEEE International Conference on Electronics, Electrical Engineering and Computing

Overview

INTERCON Peru (IEEE International Conference on Electronics, Electrical Engineering and Computing – INTERCON 2026) is an academic and professional conference focused on electronics, electrical engineering, computing and related emerging technologies, organized under the IEEE Peru Section and hosted by Universidad Privada Antenor Orrego (UPAO) in Trujillo, Peru. For 2026, official information indicates the event will run as a hybrid (in‑person and virtual) conference from December 10–12, 2026, rather than the previously communicated August 12 date.

It brings together researchers, educators, industry professionals, entrepreneurs, and students for peer‑reviewed paper presentations, keynotes, technical sessions, competitions, and networking designed to foster collaboration and advance technologies that benefit society. INTERCON’s technical program typically includes tracks and sessions spanning electronics, power and energy systems, control and automation, communications, signal processing, computer engineering, software, and interdisciplinary applications.

Accepted papers are presented in oral or poster formats, and the conference follows IEEE standards for submissions and proceedings, making it an attractive venue for authors seeking international visibility and indexing. The 2026 edition continues this tradition, emphasizing emerging and transformative technologies (aligned with IEEE Future Directions) and creating dialogue between academia and industry through invited talks and panels.

Attendees can expect a structured three‑day agenda that blends technical depth with community building. The conference program page describes INTERCON 2026 as a hybrid event aimed at researchers and educators, which implies simultaneous onsite sessions at UPAO in Trujillo and online access for remote participants.

This format broadens participation across Peru and the wider Latin American region, enabling students and professionals who cannot travel to still engage with the content. In parallel, IEEE‑related competitions and activities such as RNR 2026 (regional student branch meeting at UPAO on August 10–11) provide complementary opportunities for student leadership development and networking around the same host institution.

INTERCON matters for the Andean and Latin American engineering and computing communities because it offers a stable, IEEE‑backed platform for disseminating research results, building collaborations, and aligning local innovation with global technological trends. By convening universities, research centers, and companies at UPAO, the 2026 edition supports regional capacity building in key areas such as power systems, smart grids, embedded systems, artificial intelligence, and digital transformation.

For young researchers and students, presenting at INTERCON can be a significant step in their academic careers, while for industry participants, it is a chance to scout new talent and research partnerships. The hybrid 2026 format further increases impact by lowering geographic barriers and encouraging cross‑border participation.

What to Expect

Attendees at INTERCON 2026 can expect a structured three‑day hybrid conference that blends in‑person sessions in Trujillo with virtual access for remote participants. The event is designed to gather researchers, educators, practitioners, and students in electronics, electrical engineering, computing and related disciplines for an intensive program of technical and networking activities. The core of INTERCON is its peer‑reviewed technical program, built around a Call for Papers that specifies topics, submission format, and deadlines in line with IEEE standards. Participants can anticipate multiple parallel sessions featuring oral and poster presentations of original research, often organized into tracks covering areas such as power and energy systems, control, communications, signal processing, computer engineering, and software technologies. Because the official language of INTERCON 2026 is English, international contributors can participate and follow the sessions without language barriers. Beyond paper presentations, the conference offers keynote talks and invited lectures from distinguished speakers, as highlighted in the section showcasing the roster of previous and current speakers. These sessions typically provide high‑level views on emerging technologies and future research directions, aligning with themes inspired by IEEE Future Directions platforms. Attendees also gain access to panel discussions, workshops or special sessions tailored to current industry and academic challenges, though exact 2026 details are still being finalized. The hybrid format means participants on site at UPAO benefit from direct interaction, campus facilities, and face‑to‑face networking with colleagues and industry representatives, while online attendees can follow the live‑streamed or recorded sessions. IEEE‑affiliated competitions and student activities around UPAO, including separate events like RNR 2026, complement the main conference by fostering leadership and collaboration among student branches. Overall, participants can expect a professional, IEEE‑caliber environment suitable for knowledge exchange, research dissemination, and regional community building.

Who Should Attend

INTERCON 2026 is intended for a broad but clearly defined audience across the electronics, electrical engineering and computing ecosystem. The primary attendees are researchers and academics from universities and research institutes who seek a recognized IEEE venue to present peer‑reviewed work, stay current on advances, and build collaborations. Faculty, postdoctoral researchers, and graduate students in electrical engineering, electronic engineering, computer science, and related fields will find the range of technical tracks and sessions well aligned with their interests. A second key group is industry professionals and engineers working in sectors such as power and energy, telecommunications, industrial automation, embedded systems, software development, and ICT infrastructure. For these participants, INTERCON offers insights into cutting‑edge research with potential application in products, services, and industrial processes, as well as opportunities to connect with academic partners and recruit talent. Students—particularly senior undergraduates and master’s students—are an important audience, given the strong IEEE student branch involvement in organizing and associated events like RNR 2026. Attending INTERCON allows students to experience a full international conference environment, learn about research careers, and enhance their professional networks. This includes members of IEEE Student Branches across Peru and Latin America who use the event as a focal point for technical development and leadership activities. Finally, entrepreneurs, innovators, and policymakers interested in how emerging technologies can address societal challenges also benefit from participating. The conference’s focus on transformative technologies and alignment with IEEE Future Directions make it relevant to those planning technology‑based ventures, innovation programs, or policy initiatives in areas such as smart grids, renewable energy, digital transformation, and intelligent systems. In summary, anyone needing high‑quality, IEEE‑curated insights into electronics, electrical engineering, and computing—whether from academia, industry, or the broader innovation ecosystem—fits well within INTERCON’s target audience.

Why It Matters

INTERCON 2026 is significant because it serves as one of the main IEEE‑branded platforms in Peru and the wider region for advancing and disseminating research in electronics, electrical engineering and computing. By convening a diverse community of academics, professionals and students at Universidad Privada Antenor Orrego in Trujillo, the conference strengthens the local and national research ecosystem and builds bridges to international networks. From a scientific and technological perspective, INTERCON supports the development and deployment of emerging technologies that can address pressing societal and industrial challenges. The conference’s themes are inspired by IEEE Future Directions, emphasizing transformative areas such as smart energy systems, communications infrastructure, intelligent computing, automation and digital transformation. Sharing peer‑reviewed work on these topics helps accelerate innovation, validate ideas through community feedback, and identify pathways from lab results to practical applications. For Peru and neighboring countries, INTERCON plays a capacity‑building role. It offers researchers and students in the region a high‑visibility venue that adheres to IEEE standards, which can facilitate international recognition of their work and integration into global collaborations. That, in turn, supports the development of local expertise, encourages research funding, and motivates institutions to invest in advanced labs and training. The conference also matters for industry engagement and talent development. Companies and public sector organizations looking to modernize infrastructure or deploy advanced technologies can use INTERCON to identify partners, understand the latest technical trends, and recruit qualified engineers and researchers. For students and early‑career professionals, presenting or attending can be a pivotal experience that shapes career trajectories, exposes them to real‑world challenges, and introduces them to potential employers and mentors. Finally, the hybrid format of INTERCON 2026 lowers geographic barriers and allows participation from a wider audience than purely local, in‑person events. This inclusiveness expands the reach and impact of the work presented, and ensures that knowledge generated in Peru is shared across Latin America and beyond. As digital and physical infrastructures become increasingly interconnected, conferences like INTERCON help align regional development with global technological evolution, making them strategically important for the engineering and computing communities they serve.